GaN Epitaxial Wafers-Based Product Demand Continues to Grow
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GaN Epitaxial Wafers |
Gan Epitaxial Wafers are an essential ingredient for next-generation HEMT devices. They can enable the creation of high-frequency and high power devices that exceed the limitations of traditional silicon-based electronics. These devices have a wide range of applications including radio frequency, light-emitting diode (LED) and power electronics. The demand for GaN-based products is expected to increase significantly in the coming years as these devices are capable of operating at very high frequencies and temperatures.
GaN
Epitaxial Wafers are available in a variety of sizes
and formats to suit different device requirements. They are produced at
multiple production facilities across the world and are suitable for
applications such as power, RF and CMOS devices. TDI, a leading producer of GaN
epitaxial wafers, has expanded its R&D and manufacturing operations to a
new 3,200m2 facility in Silver Spring, Maryland. The new facility offers
expanded space for crystal growth and epitaxial deposition as well as material
characterization.
Moreover, the new fab
will also feature an automated production line to support the company's True
Bulk GaN technology. This is a unique substrate based on a novel template
synthesis process that allows a large substrate area to be grown with a small
footprint and low defect density.
To further improve
efficiency and reduce energy consumption, the company uses an artificial
intelligence-based production platform that controls crystal growth in real
time at atomic layer level. The system also monitors the crystal growth state
and learns how to maximize productivity from its monitoring data sets.
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